Xilinx Kintex UltraScale High-end FPGA Core Board SOM

·4GB DDR4,64bit

·Core Board Parameters

·GTH: 20x 12.5Gbp

·PCIe Gen3 x8

key Features

Product Performance

SOM Parameters

Core board

ACKU040

ACKU060

FPGA Chip

XCKU040-2FFVA1156I

XCKU060-2FFVA1156I

Chip Level

Industrial Grade -40°C~85°C

Industrial Grade -40°C~85°C

DDR4

4GB DDR4, 64bit

4GB DDR4, 64bit

QSPI Flas

64MB

64MB

Logic Cells

530K

726K

CLB LUTs

242,400

331,680

CLB flip-flops

484,800

663,360

Max. Distributed RAM (Kb)

7,050

9,180

Block RAM (36Kb each)

1,200

2160

Total Block RAM

21.1 Mb

38.0Mb

DSP Slices

1,920

1,920

GTH Transceiver

20x 12.5Gbp

20x 12.5Gbp

PCI Express

PCIE 3.0

PCIE 3.0

HR IO

255

255

HP IO

99

99

LVDS

120

120

Interface and Function

DDR4

4GB, 64bit, 2400Mbps

QSPI Flash

256 Mbit, Used as FPGA User Data Storage

Ｃrystal Oscillator

200Mhz Provide Stable Clock Source for the FPGA System

120 Pin Expansion Ports

4 x 120Pin + 2 x 80pin，Panasonic Industrial Grade High-Speed Inter-Board Connectors

IO

The 6 board-to-board connectors expand 359 I/Os, of which 104 I/O levels are 3.3V and the other BANKI/O is 1.8V. In addition, 20 pairs of high-speed transceiver GTH interfaces have been expanded

LED

1 Power Indicator (PWR) 1 Configure LED Light (DONE)

Power Supply Parameters

Powered

12V/3A

Package List

FPGA SoM Board

1

Structure Size

Size Dimension

3.15 inch x 2.36 inch x 0.382 inch

Number of Layers

18-Layer Core Board PCB

TOP

Bottom

Get Started Quickly

Provide Documents to Study

Shorten Learning and Development Time

 

 

Provide Schematic, PCB, Size Dimension, Packageand Reference Design, that to Accelerate the Development of products with Core Board