Xilinx Kintex UltraScale FPGA PCIE 3.0 High end development board

For high-speed data transmission and exchange, pre-verification and post-application of data processing is possible

·2x 10G SFP+Optical fiber interface

·4GB DDR4,64bit

·2x LPC,1xHPC FMC Expansion Interface

Functional Interface

·FPGA Chip

 

*For more information on the Core Board click >>

 

·Development board

Product Parameters

Core Board Parameters

FPGA Chip

XCKU040-2FFVA1156I

Chip level

Industrial Grade

DDR4

4GB DDR4, 64bit

Logic Cells

 530K

CLB LUTs

242,400

CLB Flip-Flops

484,800

Max. Distributed RAM (Kb)

7,050

Block RAM (36Kb each)

 600

Total Block RAM

21.1Mb

DSP Slices

1920

transceiver

20x 12.5Gbps

PCI Express

PCIE 3.0

HR IO

255

HP IO

99

LVDS

120

Interface and Function

DDR4

4x 1GB DDR4，4GB

QSPI Flash

Two 128Mbit  QSPI flash memory chips can be used to store FPGA chip configuration files and user data

Optical fiber interface

2-way SFP + optical fiber interface to realize 2-way high-speed optical fiber communication interface. The receiving and transmitting speed of each channel of optical fiber data communication is as high as 12.5Gb/s

FMC Extension interface

Three standard FMC expansion ports, including two LPC expansion ports and one HPC expansion port. External Xilinx or alinx FMC daughter boards (HDMI input and output module, binocular camera module, high-speed AD module, etc.)

PCIE X8 Interface

1-way PCIE3.0 X8 interface for PCIE data communication with PCs

USB Uart

1 Uart to USB interface for communication with computer and user debugging

Ethernet interface

One 10/100m/1000m Ethernet RJ45 interface is used for Ethernet data exchange with computers or other network devices

SMA interface

2-way SMA External Interface for External High Speed Input and Output Signals

Crystal Oscillator

Two 156.25Mhz differential crystal oscillator, which gives the transceiver a reference clock

JTAG

10-pin 2.54mm standard JTAG port for downloading and debugging of field programmers

Temperature Sensor

Sensor Chip LM75A, Used to Detect the Ambient Temperature

EEPROM

One EEPROM for LC bus communication and storage of customer-defined information

SD Card Slot

1-way Micro SD card holder for data read, write and storage of SD card by GA

LEDs

1 power indicator; 4 user lights, 2 panel lights

KEYs

1 reset button, 1 normal IO connected to the GA

Power Supply Parameters

Voltage Input

+12 V DC

Current Input

Max. Current 3A

Package List

FPGA Board

1

DC Fan (Fixed on the Board)

1

Mini USB Cable

1

USB Downloader Cable

1 Set

12V Power Adapter

1

 

 

Structure Size

Size Dimension

210mm x106.65mm

Number of Layers

Core panel 18 PCB board design, extension panel 12 PCB board design, reserve separate power layer and GND layer

                

Rich extension interface

High-Speed Transmission

High speed optical fiber communication, video processing, high-speed data transmission processing, etc

 

 

Support the requirements of high-speed data transmission and exchange, data storage, video transmission processing and industrial control, and the verification in the early stage of project development

Rich peripheral interfaces: 2 10G SFP+optical interface, 3 FMC extension interfaces (1 HPC, 2 LPC), 1 Gigabit Network port, 1 UART serial port, 1 SD card interface, LED keys and so on.

SFP Optical Fiber Interface

SFP Transmission Communication