This article is the replacement for the TE0703-05. All changes caused by the new revision are included in the Product Change Notification (PCN).

The Trenz Electronic TE0703 Carrier Board is a base-board for 4 x 5 SoMs, which exposes the MIO- and the PS/PL-pins of the SoM to accessible connectors and provides a whole range of on-board-components to test and evaluate Trenz Electronic 4 x 5 SoMs.

Supported functional range: Wiki Trenz Electronic 4 x 5 cm carrier boards

Features

• Two VG96 backplane connectors are not soldered to the board, but they are included in the package as separate components.
• SDIO port expander with voltage-level translation
• Micro SD card connector - Zynq SDIO0 bootable SD port
• 4 x User LEDs
  • D1 and D2 are connected to the carrier controller, their function depends on the firmware
  • D3 and D4 are connected to the 4 x 5 module B2B connector pins, and are directly controlled by the module
• Mini USB connector (USB JTAG and UART interface)
• 1 x User push button
  • Connected to "intelligent Carrier Controller (iCC)" and can be used as module reset button. Other usage possible, actual function depend on the code loaded into iCC.
• RJ45 GbE connector
• USB host connector
• Barrel jack for 5V* power supply
• 4A high efficiency power SoC DC-DC step-down converter with integrated inductor (Enpirion EN6347) for 3.3V power supply
• Trenz 4 x 5 module socket (3 x Samtec LSHM series connectors)
• USB JTAG and UART interface (FTDI FT2232H), compatible with Xilinx tools (also with many other tools)
• 4 User DIP switches
  • Enable/disable update of the "intelligent Carrier Controller"
  • MIO0 (readable signal by iCC and module)
  • 2 "mode" bits

Scope of Delivery

• 1 x TE0703-06 carrier board for Trenz Electronic modules with a form factor of 4 x 5 cm
• 2 x VG96 socket connector vertical (DIN 41612), female, series 0903, manufacturer part no. 09032967824

Additional Information

• Manufacturer's article number: TE0703-06
• Trenz Electronic Carrierboard TE0703 Wiki
• Support Forum

*Changes REV06

#1  Changed micro SD card connector (J3)

Type: BOM change

Reason: Demand for industrial temperature range

Impact: Specified for industrial temperature range

#2 Changed push button (S1)

Type: BOM change

Reason: Demand for industrial temperature range

Impact: Specified for industrial temperature range

#3 Replaced input power protection

Type:  Optimization

Reason: Cost savings

Impact: None

#4 Added jumper (J11) to select SD level shifter voltage on FPGA side

Type: Schematic change

Reason: Modules have 1.8 V or 3.3 V bank power where SD signals are connected

Impact: Select SD level shifter voltage according to module specification

#5 Added power switch for SD level shifter supply voltages

Type: Schematic change

Reason: Ensure power sequenzing of level shifter

Impact: Power sequenzing respected under any circumstances

#6 Replaced R5 by 1 kOhm and VBUS capacitors by 4.7 µF, add 0 Ohm resistors to OTG-ID net

Type: BOM change

Reason: Ensure USB-OTG compability

Impact: Board compatible to new version with microUSB connector and OTG capability

#7 Replaced jumpers by SMD versions, moved VBAT to other position

Type: Layout change

Reason: Optimize production cost

Impact: None

#8 Routing lenght of  differential pairs B34_L17,  B34_L15, B34_L21, B34_L13, B34_L10, B34_L20 changed

Type: Layout change

Reason: Other changes and limited space on PCB

Impact: Applications with exact timing requirements on these IOs have to be checked and if necessary adjusted